BGA solder ball
Product Description
bottle of 25K BGA lead ball welding!
Brand: Deep Material Technology (Taiwan);
Quantity: 25,000 pcs/bottle;
Ball Size: 0.2mm 0.25mm 0.3mm 0.35mm 0.4mm 0.45mm 0.5mm 0.55mm 0.6mm 0.65mm 0.76mm Optional
Alloy Ball: SN 63/Pb 37 ---- SGS Testing and Certification
0 VND
Solder ball ( Korea )
Solder ball is key part of a semiconductor packaging technology like BGA and CSP. Solder ball is technology-intensive product that transmit electric signals by connecting chips and boards.
KTECHVN Co., Ltd. provides high-quality products that can realize smaller size, lighter weight and higher function of semiconductors and mobile devices using self-developed unique method.
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VND VND
ROBOTICS 
SEMICONDUCTOR (MSW KOREA) 
CRYSTAL SENSOR (QCM) 
LEAD SOLDERING 
SOLDERING MACHINE (METCAL) 
SPOT WELDING (UNION) 
IONIZER BLOWER (CORE INSIGHT) 
SPRING BALANCER (TIGON) 
TIG+LASER WELDING (NICHIA) 
MRO 
